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Markondeyaraj Pulugurtha

BIOMEDICAL ENGINEERING | COLLEGE OF ENGINEERING AND COMPUTING

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10-2026

Collaborative Resarch: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS) Collaborative Resarch: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS)

03-2025

PFI-TT PFI-TT

02-2025

Advanced Power Components and Integration Advanced Power Components and Integration

02-2025

High-density and high-frequency integrated passives High-density and high-frequency integrated passives

12-2024

Advancing Medical Wearable Devices Advancing Medical Wearable Devices

12-2024

Selection of the Optimal EMI Shield Sputtering Materials Selection of the Optimal EMI Shield Sputtering Materials

11-2024

Wafer-Integrated Soft Magnetic Composite Films for Inductors with High Power Density and Efficiency Wafer-Integrated Soft Magnetic Composite Films for Inductors with High Power Density and Efficiency

07-2024

Atomic Layer Deposition Tool for High Power Density and Reliability with Nanoscale Devices Atomic Layer Deposition Tool for High Power Density and Reliability with Nanoscale Devices

02-2024

EAGER:SARE:Multiferroic Shields for Smart Analog Security EAGER:SARE:Multiferroic Shields for Smart Analog Security

10-2023

Additive Manufacturing of Heterogeneous-Integrated Systems With Chiplet-First Embedding for Wireless Sensors Additive Manufacturing of Heterogeneous-Integrated Systems With Chiplet-First Embedding for Wireless Sensors

09-2023

5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO) 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO)

11-2022

I-Corps Team: Power SLICE (Single-Layer Integration with Component Embedding) for Emerging Wearable and IoT Electronics I-Corps Team: Power SLICE (Single-Layer Integration with Component Embedding) for Emerging Wearable and IoT Electronics

06-2022

Advanced power components and integration Advanced power components and integration

09-2019

Integrated Nanoscale EMI Shielding and Thermal Structures Integrated Nanoscale EMI Shielding and Thermal Structures

08-2019

Advanced Components and Integration for Systems Packaging Advanced Components and Integration for Systems Packaging

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Shubhendu Bhardwaj

Florida International University

Elec and Computer Eng, College Of Engineering And Computing

sbhardwa@fiu.edu

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mpulugur@fiu.edu

Florida International University
11200 S.W. 8th Street
Miami, Florida 33199

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Markondeyaraj Pulugurtha

BIOMEDICAL ENGINEERING | COLLEGE OF ENGINEERING AND COMPUTING

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