Abstract
UCF researchers have developed a novel copper (Cu)-based nanoparticle technology to treat and protect plants against a broad range of disease-causing bacteria and fungi. Using industry-accepted ingredients, the new formula is based on nano-engineered particles that are designed to be more effective against copper-resistant bacterial strains such as Xanthomonas perforans. The invention contains significantly lower copper material concentrations than conventional copper bactericides. It is non-phytotoxic, water-soluble and film forming to kill and inhibit the growth of bacteria on crops.
Technical Details
The invention encompasses a unique nanotechnology particle design and method of delivering disease-fighting materials to infected plant tissues. The locally systemic particle (LSP) design consists of metal and non-metal layers formed around a silica core and shell. The first layer is a leachant-permeable base material and multi-valent metal (such as Cu). The second (outside) layer consists of an immobilized Quat material, such as quaternary ammonium. The nanoparticles are small enough to pass through leaf pores known as stomata, and then move locally inside plant tissues to attack bacteria. In addition, when the stomata of plants take up LSP materials, they serve as a Cu reservoir, extending retention in the plant tissue and enhancing the bioavailability of Cu material. This serves to reduce the need for repeated applications and limits the Cu exposure to humans as well as the plants and soil.
Benefit
Scalable, simple one-pot synthesis methodEngineered ultra-small particle design reduces copper content without sacrificing efficacyControls a broad range of plant disease-causing microorganisms (both bacterial and fungal)Stays in the plant tissue longer, serving as a Cu reservoir and minimizing exposureHigh efficacy against Cu-resistant strains of X. perforans, X. alfalfa, P. syringae, C. michiganensis and other pathogensNon-phytotoxicMarket Application
Agricultural biocide applications
Brochure
