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3D On-Chip Hybrid Micropower
Sponsoring Agency:
National Science Foundation
Investigator
Chunlei Wang
Mechanical And Mat Engineering | College Of Engineering And Computing
wangc@fiu.edu
Funding
Award
$277,695.00
Begin Date
August 1, 2015
End Date
July 31, 2019
Research Terms
Materials Engineering
Industries
Advanced Materials & Products
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