Abstract
FIU inventors fabricated a novel way to cure and bond
substrates together without the possible damage to the substrates that may be
caused from reheating during secondary curing.This method utilizes adhesives and a mesh for controlling
bond line thickness. The mesh includes fiber optic filaments that can be
irradiated with UV light which in turns radiates the adhesive bonding the
substrates together. This curing method is highly applicable to many substrates
and materials.We are seeking business partners to further develop and
commercialize the Out-of-Autoclave Curing System as a viable alternative to
existing curing systems that can be used to cure any substrate regardless of
size, shape, and thickness.
Benefit
Elimination of the use of an expensive autoclave Eliminates damage caused by secondary heating Eliminates the requirement for molds for secondary curing Can be used for any composites of any size, shape, and thickness Not limited to use for bonding composites
Market Application
All fields where composite materials and bonding structures are used
Brochure
