Interfaces with Neural Tissue for Recording and Stimulation
This implantable neural electrode device serves as a potential therapy for patients suffering from a host of neurological disorders in the central or peripheral nervous system. According to a report by the World Health Organization, neurological disorders ranging from migraines to epilepsy and dementia, affect up to one billion people worldwide, and that number is expected to rise as populations age. Researchers at the University of Florida have developed a device that far surpasses any available therapy because it enables unprecedented miniaturization and minimal power consumption. This wireless, implantable system increases health safety and convenience compared to existing external, bulky devices.
Applications
A technology in neuroprosthetics that serves as a potential therapy for patients suffering from a host of neurological disorders in the central or peripheral nervous system
Advantages
- Ability to be implanted under the skin, minimizing the risk of infection
- Increases mobility and convenience due to light weight and wireless capability
- Uses signal compression, which provides for long battery life and the ability to be recharged
- Capability of all components to be hybrid integrated on the same micro-machined substrate, minimizing fabrication costs
- Provides greater reliability and accuracy in signal recognition for longer periods of time, making it the most effective therapy available and providing a unique competitive advantage
Technology
This fully-integrated, implantable neural electrode system has low power consumption. The system utilizes an interface with neural tissue for recording, as well as stimulating, neural activity in a research subject or patient. With the use of the flexible substrate as a hybrid platform to integrate the electrodes, the amplification and signal processing electronics, and the wireless transmission and power management electronics, this therapy far surpasses anything currently available. The electrodes are integrated as a single unit with the flexible substrate while the electronics are optimized separately and then hybrid packaged. Constructing the component separately allows for more efficient and cost effective fabrication.
Brochure
