Greatly Increases Therapeutic Capacity of Connectable Neural Implants
This miniature implantable connector allows high-channel-count and high-channel-density neural implants to disconnect and reconnect without disrupting the delicate integration of tissue and neural interfaces. Advanced neural interface technologies, such as cochlear implants, deep-brain stimulators, retinal prosthetics, and brain-machine interfaces can greatly improve patient quality of life. However, today’s neural implant technology cannot easily scale to higher channel counts in order to enable improved performance while remaining small. Currently, for high-channel-density applications, the implant connection to the neural interface is permanent. Changing a battery or upgrading implant electronics requires removal of the neural interface and re-implantation, which can damage tissue. This fact illustrates the need for neural interface connectors that allow reversible connectivity for high-channel-count and high-channel-density implants.
Researchers at the University of Florida have developed a miniature implantable neural interface connector for high-channel-density and high-channel-count applications that can disconnect and reconnect without tissue damage or disturbing the electrode-tissue interface. Micro machined components establish reversible neural implant connections for applications ranging from advanced prosthetics to brain-machine interfaces.
Application
Implantable connector providing a high-channel-density and/or a high-channel-count interconnection between implanted interfaces and other implanted devices.
Advantages
- Establishes reversible high-channel-density and high-channel-density connections for advanced neural implants, removing the requirement for a permanent connection
- Can provide high (>1 ΜΩ) channel-to-channel isolation in a miniature high-density form factor
- Allows implant battery changes and upgrades without disrupting tissue-integrated interfaces and the potential for tissue damage
Technology
An isolation micro gasket, elastic interconnection array, and clamping mechanism form the miniature implantable connector. The soft silicone-type gasket material maintains high channel-to-channel isolation. Integrated array elastic conductive microelements within the gasket compress when the connector apparatus is compressed, initiating vertical electric conduction. Each elastic conductive microelement achieves multiple contact points for reliable and low-impedance electrical contacts. The clamping mechanism, consisting of a rigid top plate, ceramic header, and rigid base enclosure, maintains adequate and uniform pressure for good sealing, electrical isolation, and low contact resistance.
Brochure
