An invention that increases power density and significantly reduces the Common-Mode (CM) Electromagnetic Interference (EMI) of power electronics converters. A new design integrates two capacitors into the heatsink of a power converter and uses the heatsink as the de-link capacitor, whereby bulky de-link capacitors are eliminated. Power semiconductors are directly soldered onto the heatsink/ capacitor, as opposed to being attached through the thermal interface material. Heat transfer is enhanced, heatsink size is reduced, and parasitic capacitors between the electronical circuit and the heatsink are eliminated.
