Abstract
The University of Central Florida invention is an innovative, bonding-free, thin-film lithium niobate MEMS (micro-electromechanical system) photonic switch that offers a broad spectral bandwidth, ranging from the visible to infrared spectrum. MEMS photonic switches are essential components in optical communication systems, biomedical devices, and a variety of applications requiring precise control of light signals. The highly scalable UCF technology ensures that light passes through only one switching element regardless of size, thus streamlining the photonic switch design and improving reliability. By enabling integration with additional thin-film lithium niobate-based devices on the same chip, the UCF invention is an ideal technology for large-scale photonic integrated circuits (PICs).
Technical Details: The UCF invention uses a cantilever coupler and a vertical adiabatic coupler, which are heterogeneously integrated with a silicon nitride (SiN) platform, and a bonding-free thin film lithium niobate (TFLN) platform. Compared to existing switches, the cantilever coupler structure of the UCF device takes advantage of lithium niobate’s extensive transparency window, resulting in a wider spectral range. The cutting-edge switch also boasts an outstanding ON/OFF extinction ratio and substantial isolation between ports, making it a superior alternative to other photonic switches. Also, the fabrication process simplifies manufacturing, reduces device costs, and eliminates the need for bonding steps. This provides a competitive edge over conventional thin-film lithium niobate (TFLN) cantilever-based photonic switches.
Partnering Opportunity: The research team is seeking partners for licensing, research collaboration, or both.
Benefit
Simplifies manufacturing, cuts costs, eliminates the need for bonding stepsOffers wide spectral rangeScalable and can be integrated with other devices on the same chipCost-effective, environmentally friendlyMarket Application
Optical communication systemsBiomedical devicesData centersAR/VR technologyAerospace and defense
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