Abstract
This invention from the University of Central Florida
presents a cost-effective power module design that offers greater flexibility
in configuration. By using a polymer-ceramic composite substrate, the system
can accommodate power semiconductor devices and voltage suppression circuits on
either side, reducing size and cost. The design minimizes heat generation and
parasitic inductance, making it ideal for applications like DC circuit breakers
that operate intermittently. This approach improves reliability and simplifies
manufacturing, offering a practical alternative to conventional high-voltage
modules.
Technical Details: The power module features a polymer-ceramic composite
substrate that supports mounting of power semiconductor devices and energy
dissipation circuits on either surface. This configuration allows for reduced
parasitic inductance and improved thermal management. Optional components such
as driver circuits, heat absorbers, and potting materials enhance performance
and durability. The design supports integration of voltage suppression elements
directly on the substrate, eliminating the need for external circuitry and heat
sinks.
Benefit
Lower Manufacturing Cost: Uses affordable materials and simplifies assembly. Improved Reliability: Reduces risk of cracking and electrical transients. Compact Design: Supports dual-sided component mounting for space efficiency. Thermal Efficiency: Operates without traditional heat sinks in low-duty applications.Market Application
DC power supply systems: Aircraft, space stations and high-energy physics equipment. Renewable Energy: Grid-tied inverters and energy storage systems. Power Electronics: DC circuit breakers and high-voltage switching systems. Industrial Automation: Motor drives and control systems. Transportation: Electric vehicle power modules and railway systems.
Brochure
