Abstract
Researchers at the University of Central Florida have designed a more reliable, simple, and efficient thermal conduction switch that is based on shape memory alloy. Thermal conduction switches play an important role in heat management for numerous systems. They are used in spacecraft and satellites for applications such as cooling of reservoirs and equipment, and long-term storage of ascent module propellant. However, current thermal switch technology fails to deliver performance requirements needed for certain low-temperature applications, such as those found in space and certain ground-based environments. These performance requirements include high efficiency, good thermal isolation, high heat transfer, high reliability and simplicity of design (e.g., no reliance on external sensors or complex control mechanism devices).
Technical Details
The thermal conduction switch comprises shape memory alloys that are a unique class of material. The alloys possess the ability to remember a shape and return to that predetermined form upon heating them to a given temperature. This property eliminates the use of sensors and control devices.
Benefit
Simpler and less expensive than current technologyDoes not uses expensive sensors or control devicesUsable in low temperaturesMarket Application
AerospaceDefenseSatellitesSpacecraftCooling of equipmentLong-term storage of ascent module propellants
Brochure
