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CAREER: Reliability of Three-dimensional Interconnects for Heterogeneous Integration: An Integrated Experimental and Modeling Study
Principal Investigator: Tengfei Jiang
University of Central Florida
College of Engineering & Computer Science
Sponsoring Agencies: National Science Foundation (NSF)
Natl Science Fdn (NSF)
Award: $397,301
Begin Date: 03-01-2022
End Date: 02-28-2027
Project Research Terms: Physical Sciences > Physics

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