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Direct to Silicon Microfluidic Cooling Platform
Sponsoring Agency:
Intel Corporation
Investigators
Reza Abdolvand
Electrical and Computer Engineering - Academic Instruction, College Of Engineering & Computer Science
REZA.ABDOLVAND@ucf.edu
Yoav Peles
Mechanical & Aerospace Engineering - Academic Instruction, College Of Engineering & Computer Science
Yoav.Peles@ucf.edu
Funding
Award
$300,000.00
Begin Date
February 1, 2026
End Date
December 31, 2026
Research Terms
Electrical Engineering
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