A team at FAMU and the FAMU-FSU College of Engineering developed a new way to design and build microwave circuits using AI and 3D printing. They applied a computational technique called inverse design to determine the optimal structure of a microwave power splitter, removing the need to begin with a fixed circuit layout and making it easier to adapt designs for different frequencies, devices. and applications.

“Our approach uses AI-driven inverse design without a predetermined circuit topology. By simultaneously 3D printing conductor and dielectric materials, we break through the limitations of traditional design to realize multifunctional microelectronics devices and circuits in true 3D form,” says Bayaner Arigong. Because the final design comes from the optimization algorithm, it is not constrained to any particular circuit shape and the algorithm accounts for the realities of manufacturing as it works.

• Bayaner Arigong