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DEVELOPMENT OF CONTROLLED-AMBIENT WAFER BONDING SYSTEM
Sponsoring Agency:
TECHNICAL MANAGEMENT CONCEPT
Investigator
Mark Sheplak
Professor
Eg-Mechanical / Aerospace Eng | College-Engineering
352-392-3983
sheplak@ufl.edu
Funding
Award
$11,895.00
Begin Date
June 1, 1999
End Date
January 1, 2000
Research Terms
Mechanical Engineering
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